SN74AUC17 HEX SCHMITT-TRIGGER BUFFER FEATURES

SN74AUC17
HEX SCHMITT-TRIGGER BUFFER
www.ti.com
SCES497A – OCTOBER 2003 – REVISED MARCH 2005
FEATURES
•
V
CC
41
2
31 A6
3
21 Y6
4
11 A5
5
6
01 Y5
9 A4
7
8
Y4
•
•
•
•
•
1
Y1
A2
Y2
A3
Y3
A1
•
P YG
ER
GAKCA
)WEIVTP( O
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
Ioff Supports Partial-Power-Down Mode
Operation
Sub-1-V Operable
Max tpd of 1.8 ns at 1.8 V
Low Power Consumption, 10-µA Max ICC
±8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DNG
•
DESCRIPTION/ORDERING INFORMATION
This hex Schmitt-trigger buffer is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to
1.95-V VCC operation.
The SN74AUC17 contains six independent buffers and performs the Boolean function Y = A. The device
functions as six independent buffers, but because of Schmitt action, it may have different input threshold levels
for positive-going (VT+) and negative-going (VT–) signals.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
QFN – RGY
ORDERABLE PART NUMBER
Tape and reel
SN74AUC17RGYR
TOP-SIDE MARKING
MS17
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(EACH INVERTER)
INPUT
A
OUTPUT
Y
H
H
L
L
LOGIC DIAGRAM, EACH BUFFER (POSITIVE LOGIC)
A
Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
www.BDTIC.com/TI
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2005, Texas Instruments Incorporated
SN74AUC17
HEX SCHMITT-TRIGGER BUFFER
www.ti.com
SCES497A – OCTOBER 2003 – REVISED MARCH 2005
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
3.6
V
VI
Input voltage range (2)
–0.5
3.6
V
–0.5
3.6
V
–0.5
VCC + 0.5
state (2)
UNIT
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Output voltage range (2)
IIK
Input clamp current
VI < 0
–50
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
±100
mA
Continuous current through VCC or GND
θJA
Package thermal
Tstg
Storage temperature range
(1)
(2)
(3)
impedance (3)
–65
V
mA
47
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-5.
Recommended Operating Conditions (1)
MIN
MAX
0.8
2.7
V
Input voltage
0
3.6
V
Output voltage
0
VCC
V
VCC
Supply voltage
VI
VO
IOH
IOL
TA
(1)
2
High-level output current
Low-level output current
VCC = 0.8 V
–0.7
VCC = 1.1 V
–3
VCC = 1.4 V
–5
VCC = 1.65 V
–8
VCC = 2.3 V
–9
VCC = 0.8 V
0.7
VCC = 1.1 V
3
VCC = 1.4 V
5
VCC = 1.65 V
8
VCC = 2.3 V
9
Operating free-air temperature
–40
85
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
www.BDTIC.com/TI
UNIT
mA
mA
°C
SN74AUC17
HEX SCHMITT-TRIGGER BUFFER
www.ti.com
SCES497A – OCTOBER 2003 – REVISED MARCH 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP (1) MAX
VCC
0.8 V
VT+
Positive-going input
threshold voltage
1.1 V
0.51
1.4 V
0.65
1
0.79
1.16
2.3 V
1.11
1.56
VOH
VOL
V
0.3
1.1 V
0.22
0.53
1.4 V
0.3
0.58
1.65 V
0.39
0.62
2.3 V
0.58
0.8 V
∆VT
Hysteresis
(VT+ – VT–)
0.86
1.65 V
0.8 V
VT–
Negative-going input
threshold voltage
UNIT
0.5
V
0.87
0.21
1.1 V
0.25
0.38
1.4 V
0.31
0.5
1.65 V
0.37
0.62
2.3 V
0.48
0.77
IOH = –100 µA
0.8 V to 2.7 V
IOH = –0.7 mA
0.8 V
IOH = –3 mA
1.1 V
0.8
IOH = –5 mA
1.4 V
1
IOH = –8 mA
1.65 V
1.2
IOH = –9 mA
2.3 V
1.8
IOL = 100 µA
0.8 V to 2.7 V
V
VCC – 0.1
0.55
V
0.2
IOL = 0.7 mA
0.8 V
IOL = 3 mA
1.1 V
0.25
0.3
IOL = 5 mA
1.4 V
0.4
IOL = 8 mA
1.65 V
0.45
IOL = 9 mA
2.3 V
0.6
V
VI = VCC or GND
0 to 2.7 V
±5
µA
Ioff
VI or VO = 2.7 V
0
±10
µA
ICC
VI = VCC or GND,
10
µA
Ci
VI = VCC or GND
II
(1)
A inputs
IO = 0
0.8 V to 2.7 V
2.5 V
2.5
pF
All typical values are at TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 0.8 V
A
Y
6.7
tpd
TYP
VCC = 1.2 V
± 0.1 V
MIN MAX
1.3
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
MIN
MAX
MIN
1
2.2
0.9
3.5
VCC = 2.5 V
± 0.2 V
TYP MAX
1.2
1.8
MIN
MAX
0.7
1.4
UNIT
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
MIN
TYP
MAX
MIN
MAX
1.3
1.7
2.4
1.2
1.9
www.BDTIC.com/TI
UNIT
ns
3
SN74AUC17
HEX SCHMITT-TRIGGER BUFFER
www.ti.com
SCES497A – OCTOBER 2003 – REVISED MARCH 2005
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
4
Power dissipation
capacitance
TEST
CONDITIONS
VCC = 0.8 V
VCC = 1.2 V
VCC = 1.5 V
VCC = 1.8 V
VCC = 2.5 V
TYP
TYP
TYP
TYP
TYP
f = 10 MHz
18
19
19
20
22
www.BDTIC.com/TI
UNIT
pF
SN74AUC17
HEX SCHMITT-TRIGGER BUFFER
www.ti.com
SCES497A – OCTOBER 2003 – REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
2 ×V CC
1S
RL
tuptuO morF
T rednU
TSET
nepO
DNG
tse
CL
1S
tP LHt/ PH L
tP LZt/ P ZL
tPH Zt/ P ZH
nepO
2 ×V CC
DNG
RL
)A etoN ees(
CL
V CC
V 8.0
V 2.1 V 1
±.0
V 5.1 V 1
±.0
V 8.1 V 51
±.0
V 5.2 V 2
±.0
V 8.1 V 51
±.0
V 5.2 V 2
±.0
TIUCRIC DAOL
V∆
RL
k2
k2
k2
k2
k2
k1
005
Fp 51
Fp 51
Fp 51
Fp 51
Fp 51
Fp 03
Fp 03
Ω
Ω
Ω
Ω
Ω
Ω
Ω
V 1.0
V 1.0
V 1.0
V 51.0
V 51.0
V 51.0
V 51.0
V CC
tupnI gniT
mi
V CC2/
V0
tw
tsu
th
V CC
V CC2/
tupnI
V CC2/
V CC
V CC2/
tupnI ataD
V CC2/
V0
LOW
V EGTSAMROFA
EV
ARUD ESLUP
NOIT
LOW
V EGTSAMROFA
EV
SEMIT DLOH DNA PUTES
V CC
V CC2/
tupnI
V0
V CC2/
V0
tPH L
tP LH
V CC
tuptuO
lortnoC
tuptuO
1 mrofW
eva
2 ta 1S
×V CC
VO L)B etoN ees(
V CC2/
V CC2/
V0
tP ZL
tP LZ
V CC
VO H
V CC2/
tuptuO
V CC2/
tPH L
tuptuO
V CC2/
LOW
V EGTSAMROFA
EV
PORPALAEGDANOIT SEMIT Y
tuptuO
VO H
2 mrofW
eva
DNG ta 1S
VO)LB etoN ees(
∆
VO L
tPH Z
V CC2/
VO
VH−
∆
VO H
V≈0
LOW
V EGTSAMROFA
EV
SEMIT ELBASID DNA ELBANE
GNILBANE LEVEL-HG
WIH
OLDNA -
VNINON DNA GNITREVNI
.ecnaticap:aScEgTijOdN
na eborp s.AeduC
lcnLi
retni htiw tuptuo na rof si 1 .m
BrofW
eva
cus snoitidnoc lanretni htiw m
turpotfW
ueovana rof si 2
g yb deilppus era seslup tu.pCni llA
ta eno derusaem era stuptu.D
o ehT
.Et sat tP
edm
nZaas ehtPeHrZa
L
.Ft sat tP
edm
nLaas ehtPeZH
ra
Z
.Gt sat tPedLm
nHaas ehtPeHrLa
ra smrofevaw dna sretema.rH
ap llA
VV
O L+
tP ZH
tP LH
V CC2/
V CC2/
.lortnoc tuptuo eht yb delbasid nehw tpecxe ,
Z ,zHM 0≤1
05eO=
tar weΩ
ls ,
.sn/V≥1
d si .
en .
pd .
Figure 1. Load Circuit and Voltage Waveforms
www.BDTIC.com/TI
5
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AUC17RGYR
ACTIVE
VQFN
RGY
14
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74AUC17RGYRG4
ACTIVE
VQFN
RGY
14
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
www.BDTIC.com/TI
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74AUC17RGYR
Package Package Pins
Type Drawing
VQFN
RGY
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
330.0
12.4
3.75
B0
(mm)
K0
(mm)
P1
(mm)
3.75
1.15
8.0
www.BDTIC.com/TI
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AUC17RGYR
VQFN
RGY
14
3000
346.0
346.0
29.0
www.BDTIC.com/TI
Pack Materials-Page 2
www.BDTIC.com/TI
www.BDTIC.com/TI
www.BDTIC.com/TI
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
www.BDTIC.com/TI