Reflow soldering footprint SOT950-1 Footprint information for reflow soldering of TFBGA208 package

Reflow soldering footprint
Footprint information for reflow soldering of TFBGA208 package
SOT950-1
Hx
P
P
Hy
0.475
see detail X
solder land
CL
solder paste deposit
SR
CU
solder land plus solder paste
SP
occupied area
solder resist
detail X
Dimensions in mm
P
Hx
Hy
SP
CU
SR
CL
0.8
15.25
15.25
0.425
0.475
0.575
0.675
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