MAX2410 Low-Cost RF Up/Downconverter with LNA and PA Driver ________________General Description
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MAX2410 Low-Cost RF Up/Downconverter with LNA and PA Driver ________________General Description
19-1320; Rev 1; 3/98 NUAL KIT MA ATION EET H S A EVALU T WS DA O L L O F Low-Cost RF Up/Downconverter with LNA and PA Driver ____________________________Features The MAX2410 performs the RF front-end transmit/receive function in time-division-duplex (TDD) communication systems. It operates over a wide frequency range and is optimized for RF frequencies around 1.9GHz. Applications include most popular cordless and PCS standards. The MAX2410 contains a low-noise amplifier (LNA), a downconverter mixer, a local-oscillator (LO) buffer, an upconverter mixer, and a variable-gain power-amplifier (PA) driver in a low-cost, plastic surface-mount package. The LNA has a 2.4dB (typical) noise figure and a -10dBm input third-order intercept point (IP3). The downconverter mixer has a low 9.8dB noise figure and a 3.3dBm IP3. Image and LO filtering are implemented offchip for maximum flexibility. The PA driver has 15dB of gain, which can be reduced over a 35dB (typical) range. Power consumption is only 60mW in receive mode or 90mW in transmit mode and drops to less than 0.3µW in shutdown mode. A similar part, the MAX2411A, features the same functionality as the MAX2410 but offers a differential bidirectional (transmit and receive) IF port. This allows the use of a single IF filter for transmit (TX) and receive (RX). For applications requiring a receive function only, consult the data sheet for the MAX2406, a low-cost downconverter with low-noise amplifier. ♦ Low-Cost Silicon Bipolar Design ♦ Integrated Upconvert/Downconvert Function ________________________Applications ___________________Pin Configuration PWT1900 DCS1800/PCS1900 PHS/PACS DECT ISM-Band Transceiver Iridium Handsets ♦ Operates from Single +2.7V to +5.5V Supply ♦ 3.2dB Combined Receiver Noise Figure: 2.4dB (LNA) 9.8dB (Mixer) ♦ Flexible Power-Amplifier Driver: 18dBm Output Third-Order Intercept (OIP3) 35dB Gain Control Range ♦ LO Buffer for Low LO Drive Level ♦ Low Power Consumption: 60mW Receive 90mW Full-Power Transmit ♦ 0.3µW Shutdown Mode ♦ Flexible Power-Down Modes Compatible with MAX2510/MAX2511 IF Transceivers _______________Ordering Information TEMP. RANGE PIN-PACKAGE MAX2410EEI PART -40°C to +85°C 28 QSOP MAX2410E/D -40°C to +85°C Dice* *Dice are specified at TA = +25°C, DC parameters only. TOP VIEW 28 GND GND 1 27 LNAOUT LNAIN 2 Functional Diagram GND 3 26 GND GND 4 25 GND VCC 5 LNAOUT RXMXIN LNA IFOUT RX MIXER LNAIN RXEN TXEN PADROUT RXEN 6 POWER MANAGEMENT MAX2410 PA DRIVER 24 RXMXIN MAX2410 LO 7 22 IFIN LO 8 21 IFOUT TXEN 9 LO LO TX MIXER IFIN 20 GND 19 TXMXOUT VCC 10 GC 11 18 GND GND 12 17 GND 16 PADRIN PADROUT 13 15 GND GND 14 GC PADRIN 23 GND TXMXOUT QSOP ________________________________________________________________ Maxim Integrated Products 1 For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800. For small orders, phone 1-800-835-8769. www.BDTIC.com/maxim MAX2410 ________________General Description MAX2410 Low-Cost RF Up/Downconverter with LNA and PA Driver ABSOLUTE MAXIMUM RATINGS VCC to GND ..............................................................-0.3V to +6V LNAIN Input Power.........................................................+15dBm LO, LO Input Power........................................................+10dBm PADRIN Input Power ......................................................+10dBm RXMXIN Input Power ......................................................+10dBm IFIN Input Power.............................................................+10dBm RXEN, TXEN, GC Voltage...........................-0.3V to (VCC + 0.3V) Continuous Power Dissipation (TA = +70°C) QSOP (derate 11mW/°C above +70°C) .......................909mW Junction Temperature ......................................................+150°C Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-65°C to +165°C Lead Temperature (soldering, 10sec) .............................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (VCC = 2.7V to 5.5V, VGC = 3.0V, RXEN = TXEN = 0.6V, IFOUT and PADROUT pulled up to VCC with 50Ω resistors, TXMXOUT pulled up to VCC with 125Ω resistor, LNAOUT pulled up to VCC with 100Ω resistor, all other RF and IF inputs open, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C and VCC = 3.0V.) PARAMETER CONDITIONS Supply Voltage Range MIN TYP 2.7 Digital Input Voltage High RXEN, TXEN pins Digital Input Voltage Low RXEN, TXEN pins RXEN Input Bias Current (Note 1) RXEN = 2V 0.1 TXEN Input Bias Current (Note 1) TXEN = 2V GC Input Bias Current GC = 3V, TXEN = 2V Supply Current, Receive Mode RXEN = 2V Supply Current, Transmit Mode Supply Current, Standby Mode Supply Current, Shutdown Mode MAX UNITS 5.5 V 2.0 V 0.6 V 1 µA 0.1 1 µA 35 46 µA 20 29.5 mA TXEN = 2V 30 44.5 mA RXEN = 2V, TXEN = 2V 160 520 µA VCC = 3V 0.1 10 µA AC ELECTRICAL CHARACTERISTICS (MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN = 1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω environment. TA = +25°C, unless otherwise noted.) PARAMETER CONDITIONS MIN TYP MAX UNITS 14.2 12.6 16.2 17.4 19.1 dB LOW-NOISE AMPLIFIER (RXEN = High) TA = +25°C TA = TMIN to TMAX Gain (Note 1) Noise Figure Input IP3 (Note 2) Output 1dB Compression LO to LNAIN Leakage RXEN = high or low 2.4 dB -10 dBm -5 dBm -49 dBm RECEIVE MIXER (RXEN = High) Conversion Gain (Note 1) TA = +25°C TA = TMIN to TMAX Noise Figure Single sideband 9.8 dB Input IP3 (Note 3) 3.3 dBm Input 1dB Compression 8.3 9.8 10.8 -8 IFOUT Frequency (Notes 1, 4) Minimum LO Drive Level (Note 5) 2 6.6 5.4 dB dBm 450 -17 _______________________________________________________________________________________ www.BDTIC.com/maxim MHz dBm Low-Cost RF Up/Downconverter with LNA and PA Driver (MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN = 1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω environment. TA = +25°C, unless otherwise noted.) PARAMETER CONDITIONS MIN TYP TA = +25°C 8.6 10 TA = TMIN to TMAX 7.3 MAX UNITS TRANSMIT MIXER (TXEN = high) Conversion Gain (Note 1) Output IP3 (Note 6) Output 1dB Compression Point LO Leakage Noise Figure Single sideband IFIN Frequency (Notes 1, 4) Intermod Spurious Response (Note 7) 11.1 11.8 dB -0.3 dBm -11.4 dBm -52 dBm 8.2 dB 450 MHz fOUT = 2LO-2IF = 2.2GHz -44 dBc fOUT = 2LO-3IF = 1.8GHz -74 dBc fOUT = 3LO-6IF = 2.1GHz -90 dBc POWER AMPLIFIER DRIVER (TXEN = high) TA = +25°C Gain (Note 1) TA = TMIN to TMAX Output IP3 (Note 3) 13 15 12.3 16.4 17 dB 18 dBm Output 1dB Compression Point 6.3 dBm Gain-Control Range 35 dB 12 dB/V Gain-Control Sensitivity (Note 8) LOCAL OSCILLATOR INPUTS (RXEN = TXEN = high) Input Relative VSWR Normalized to Standby-Mode Impedance Receive (TXEN = Low) 1.10 Transmit (RXEN = Low) 1.02 POWER MANAGEMENT (RXEN = TXEN = low) Receiver Turn-On Time (Notes 1, 9) 0.5 2.5 µs Transmitter Turn-On Time (Notes 1, 10) 0.3 2.5 µs Guaranteed by design and characterization. Two tones at 1.9GHz and 1.901GHz at -32dBm per tone Two tones at 1.9GHz and 1.901GHz at -22dBm per tone Mixer operation guaranteed to this frequency. For optimum gain, adjust output match. See the Typical Operating Characteristics for graphs of IFIN and IFOUT Impedance vs. IF Frequency. Note 5: At this LO drive level the mixer conversion gain is typically 1dB lower than with -10dBm LO drive. Note 6: Two tones at 400MHz and 401MHz at -32dBm per tone. Note 7: Transmit mixer output at -17dBm. Note 8: Calculated from measurements taken at VGC = 1.0V and VGC = 1.5V. Note 9: Time from RXEN = low to RXEN = high transition until the combined receive gain is within 1dB of its final value. Measured with 47pF blocking capacitors on LNAIN and LNAOUT. Note 10: Time from TXEN = low to TXEN = high transition until the combined transmit gain is within 1dB of its final value. Measured with 47pF blocking capacitors on PADRIN and PADROUT. Note 1: Note 2: Note 3: Note 4: _______________________________________________________________________________________ www.BDTIC.com/maxim 3 MAX2410 AC ELECTRICAL CHARACTERISTICS (continued) __________________________________________Typical Operating Characteristics (MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN = 1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω environment. TA = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).) VCC = 4.0V 32 30 VCC = 3.0V 28 VCC = 2.7V 26 VCC = 5.5V 22 VCC = 4.0V 21 20 19 VCC = 3.0V 18 VCC = 2.7V 0.06 0.05 0.04 35 60 85 400 0 -40 -15 10 35 60 300 VCC = 4.0V 200 0 60 40 0 RXEN = VCC 80 -40 60 -80 40 -120 1.0 TEMPERATURE (°C) REAL 0.5 1.0 0 13 3.0 1.5 2.0 2.5 -125 3.0 LNA INPUT IP3 vs. TEMPERATURE VCC = 5.5V 16 14 2.5 -100 FREQUENCY (GHz) 17 5 FREQUENCY (GHz) -75 0 -5 RXEN = VCC -6 VCC = 4.0V 15 2.0 100 0 INPUT IP3 (dBm) 10 1.5 -50 -7 LNA GAIN (dB) 15 1.0 150 3.0 MAX2410-08 MAX2410-07 RXEN = VCC 19 18 20 0.5 2.5 20 RXEN = VCC 0 2.0 -25 LNA GAIN vs. TEMPERATURE 1pF SHUNT CAPACITOR AT LNA INPUT USING EV KIT MATCHING CIRCUIT (OPTIMIZED FOR 1.9GHz) 25 1.5 0 IMAGINARY FREQUENCY (GHz) LNA GAIN vs. FREQUENCY 30 MAX2410-06 50 -200 0.5 85 200 -160 0 60 250 IMAGINARY 100 85 35 RXEN = VCC 0 35 10 LNA OUTPUT IMPEDANCE vs. FREQUENCY 20 VCC = 2.7V 10 -15 TEMPERATURE (°C) REAL VCC = 3.0V -15 -40 85 MAX2410-05 120 REAL IMPEDANCE (Ω) VCC = 5.5V -40 VCC = 3.0V VCC = 2.7V LNA INPUT IMPEDANCE vs. FREQUENCY RXEN = TXEN = 2.0V 100 VCC = 4.0V 0.02 TEMPERATURE (°C) MAX2410-04 500 VCC = 5.5V 0.03 REAL IMPEDANCE (Ω) 10 STANDBY SUPPLY CURRENT vs. TEMPERATURE STANDBY SUPPLY CURRENT (µA) 0.07 0.01 IMAGINARY IMPEDANCE (Ω) -15 TEMPERATURE (°C) 4 0.08 17 -40 RXEN = TXEN = GND 0.09 -8 -9 -10 VCC = 4.0V -11 -12 VCC = 2.7V VCC = 5.5V -13 VCC = 3.0V VCC = 3.0V VCC = 2.7V -14 -15 -40 -15 10 35 TEMPERATURE (°C) 60 85 -40 -20 0 20 40 60 TEMPERATURE (°C) _______________________________________________________________________________________ www.BDTIC.com/maxim 80 100 IMAGINARY IMPEDANCE (Ω) 34 23 0.10 MAX2410-09 VCC = 5.5V RXEN = VCC SHUTDOWN SUPPLY CURRENT (µA) 36 24 MAX2410-02 TXEN = VCC RECEIVE-MODE SUPPLY CURRENT (mA) MAX2410-01 TRANSMIT-MODE SUPPLY CURRENT (mA) 38 SHUTDOWN SUPPLY CURRENT vs. TEMPERATURE RECEIVE-MODE SUPPLY CURRENT vs. TEMPERATURE MAX2410-03 TRANSMIT-MODE SUPPLY CURRENT vs. TEMPERATURE LNA GAIN (dB) MAX2410 Low-Cost RF Up/Downconverter with LNA and PA Driver Low-Cost RF Up/Downconverter with LNA and PA Driver (MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN = 1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω environment. TA = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).) 3.0 2.5 2.0 1.5 1.0 0.5 0 -2 -3 -4 480 860 1240 1620 2000 -50 80 -90 60 -130 -170 REAL -210 20 -250 0 2.7 3.2 3.7 4.2 4.7 0 5.2 0.5 1.0 1.5 2.0 2.5 PA DRIVER OUTPUT IMPEDANCE vs. FREQUENCY PA DRIVER GAIN vs. FREQUENCY PA DRIVER GAIN AND OUTPUT IP3 vs. GAIN-CONTROL VOLTAGE USING EV KIT MATCHING NETWORK (OPTIMIZED FOR 1.9GHz) 0 -50 125 -100 100 -150 75 -200 50 -250 REAL 20 10 5 -300 0 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 0.5 1.0 1.5 2.0 2.5 VCC = 4.0V VCC = 3.0V 17 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 PA DRIVER OUTPUT 1dB COMPRESSION POINT vs. SUPPLY VOLTAGE VCC = 5.5V 16 VCC = 4.0V 15 VCC = 2.7V 14 15 13 14 12 40 -20 60 80 100 VCC = 3.0V 8 MAX2410-18 TXEN = VCC VCC = 2.7V 20 -15 GAIN-CONTROL VOLTAGE (V) 18 PA DRIVER GAIN (dB) 18 TEMPERATURE (°C) -10 3.0 VCC = 5.5V 0 GAIN -30 0 3.0 MAX2410-16 20 -20 0 -5 PA DRIVER GAIN vs. TEMPERATURE TXEN = VCC 16 IP3 5 FREQUENCY (GHz) 21 17 10 -25 PA DRIVER OUTPUT IP3 vs. TEMPERATURE 19 TXEN = VCC 15 0 -350 0.5 15 20 OUTPUT 1dB COMPRESSION POINT (dBm) 25 TXEN = VCC GAIN (dB) IMAGINARY 150 25 3.0 MAX2410-15 30 50 GAIN (dB) OR OUTPUT IP3 (dBm) MAX2410-13 MAX2410-14 FREQUENCY (GHz) IMAGINARY IMPEDANCE (Ω) REAL IMPEDANCE (Ω) 100 SUPPLY VOLTAGE (V) 175 OUTPUT IP3 (dBm) -10 40 -5 TXEN = VCC -40 IMAGINARY 120 FREQUENCY (MHz) 200 0 30 140 -6 100 70 TXEN = VCC 6 VGC = 2.15V 4 TXEN = VCC 2 0 -2 VGC = 1.0V -4 -40 -15 10 35 TEMPERATURE (°C) 60 85 2.7 3.2 3.7 4.2 4.7 5.2 5.7 SUPPLY VOLTAGE (V) _______________________________________________________________________________________ www.BDTIC.com/maxim 5 IMAGINARY IMPEDANCE (Ω) 3.5 -1 MAX2410-17 NOISE FIGURE (dB) 4.0 RXEN = VCC MAX2410-12 160 REAL IMPEDANCE (Ω) OUTPUT 1dB COMPRESSION POINT (dBm) RXEN = VCC MAX2410-11 0 MAX2410-10 5.0 4.5 PA DRIVER INPUT IMPEDANCE vs. FREQUENCY LNA OUTPUT 1dB COMPRESSION POINT vs. SUPPLY VOLTAGE LNA NOISE FIGURE vs. FREQUENCY MAX2410 _____________________________Typical Operating Characteristics (continued) _____________________________Typical Operating Characteristics (continued) (MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN = 1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω environment. TA = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).) 25 5 4 20 15 10 5 -120 -140 REAL -160 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 IF OUTPUT IMPEDANCE vs. FREQUENCY -300 600 -400 500 -500 400 -600 300 -700 REAL 100 100 200 300 400 500 600 2.0 2.5 FREQUENCY (GHz) RECEIVE MIXER CONVERSION GAIN vs. TEMPERATURE RECEIVE MIXER INPUT IP3 vs. TEMPERATURE VCC = 5.5V 8 VCC = 2.7V 7 -200 3.0 7 RXEN = VCC 6 VCC = 4.0V VCC = 5.5V 5 4 3 VCC = 2.7V VCC = 3.0V 2 1 5 0 -40 -15 10 35 60 85 -40 -20 0 20 40 60 80 100 TEMPERATURE (°C) RECEIVE MIXER CONVERSION GAIN vs. RF FREQUENCY RECEIVE MIXER CONVERSION GAIN AND NOISE FIGURE vs. LO POWER TRANSMIT MIXER OUTPUT IMPEDANCE vs. FREQUENCY EV KIT MATCHING NETWORK AT RXMXIN AND IFOUT 2 RXEN = VCC fIF = 400MHz 1.5 2.0 RF FREQUENCY (GHz) 2.5 3.0 MAX2410-26 12 NOISE FIGURE 11 10 9 8 GAIN 7 MAX2410-27 300 250 -25 200 IMAGINARY -75 100 -100 50 -125 REAL 0 -50 5 -100 -8 -6 LO POWER (dBm) -4 -2 0 -50 150 6 -18 -16 -14 -12 -10 0 TXEN = VCC REAL IMPEDANCE (Ω) 8 1.0 RXEN = VCC GAIN AND NOISE FIGURE (dB) 10 13 MAX2410-25 NARROWBAND MATCH AT RXMXIN, EV KIT MATCH AT IFOUT 0.5 1.5 TEMPERATURE (°C) 12 0 1.0 FREQUENCY (MHz) 14 4 0.5 6 -1000 700 16 6 0.0 3.0 -900 0 0 2.5 GAIN-CONTROL VOLTAGE (V) 9 -800 200 2.0 INPUT IP3 (dBm) -200 IMAGINARY 700 CONVERSION GAIN (dB) 800 1.5 RXEN = VCC -100 IMAGINARY IMPEDANCE (Ω) 900 1.0 10 0 RXEN = VCC 0.5 MAX2410-23 MAX2410-21 1000 -180 MAX2410-24 0 FREQUENCY (GHz) REAL IMPEDANCE (Ω) -100 40 0 0 0 6 -80 50 10 0 -4 -60 60 20 1 -2 -40 IMAGINARY 70 30 3 2 -20 -150 -175 0 0.5 1.0 1.5 2.0 FREQUENCY (GHz) _______________________________________________________________________________________ www.BDTIC.com/maxim 2.5 -200 3.0 IMAGINARY IMPEDANCE (Ω) 6 REAL IMPEDANCE (Ω) NOISE FIGURE (dB) NOISE FIGURE (dB) 7 90 80 8 0 RXEN = VCC IMAGINARY IMPEDANCE (Ω) MAX2410-19 TXEN = VCC TXEN = VCC MAX2410-21 100 MAX2410-20 30 10 9 RECEIVE MIXER INPUT IMPEDANCE vs. FREQUENCY PA DRIVER NOISE FIGURE vs. GAIN-CONTROL VOLTAGE PA DRIVER NOISE FIGURE vs. FREQUENCY CONVERSION GAIN (dB) MAX2410 Low-Cost RF Up/Downconverter with LNA and PA Driver Low-Cost RF Up/Downconverter with LNA and PA Driver (MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN = 1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω environment. TA = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).) TXEN = VCC TXEN = VCC IMAGINARY 300 -600 200 -900 100 REAL 200 300 400 500 600 VCC = 2.7V VCC = 3.0V -1500 700 -40 -15 10 35 60 VCC = 3.0V VCC = 2.7V 1.0 1.5. 2.0 2.5 3.0 3.5 LO PORT RETURN LOSS vs. FREQUENCY MAX2410-32 0 5 RXEN = TXEN = VCC 10 TXEN = VCC RETURN LOSS (dB) -1.0 TXEN = VCC 0.5 10 9 8 EV KIT MATCHING NETWORK 4 RF FREQUENCY (GHz) GAIN GAIN AND NOISE FIGURE (dB) -0.5 6 85 11 MAX2410-31 VCC = 4.0V 8 0 6 TRANSMIT MIXER GAIN AND NOISE FIGURE vs. LO POWER VCC = 5.5V 3GHz MATCH 2 TRANSMIT MIXER OUTPUT IP3 vs. TEMPERATURE TXEN = VCC OUTPUT IP3 (dBm) 9 TEMPERATURE (°C) 0.5 -1.5 10 FREQUENCY (GHz) 1.0 0 VCC = 4.0V 7 0 100 VCC = 5.5V 11 8 -1200 0 12 900MHz MATCH 10 CONVERSION GAIN (dB) -300 CONVERSION GAIN (dB) 13 IMAGINARY IMPEDANCE (Ω) REAL IMPEDANCE (Ω) 400 12 MAX2410-30 14 0 MAX2410-29 MAX2410-28 500 TRANSMIT MIXER CONVERSION GAIN vs. RF FREQUENCY TRANSMIT MIXER CONVERSION GAIN vs. TEMPERATURE MAX2410-33 IF INPUT IMPEDANCE vs. FREQUENCY NOISE FIGURE 15 20 25 30 7 35 -2.0 40 6 -40 -15 10 35 TEMPERATURE (°C) 60 85 -18 -16 -14 -12 -10 -8 -6 LO POWER (dBm) -4 -2 0 0 0.5 1.0 1.5 2.0 2.5 3.0 FREQUENCY (GHz) _______________________________________________________________________________________ www.BDTIC.com/maxim 7 MAX2410 _____________________________Typical Operating Characteristics (continued) MAX2410 Low-Cost RF Up/Downconverter with LNA and PA Driver ______________________________________________________________Pin Description 8 PIN NAME FUNCTION 1, 3, 4, 12, 14, 18, 20, 23, 28 GND 2 LNAIN RF Input to the LNA. AC couple to this pin. At 1.9GHz, LNAIN can be easily matched to 50Ω with one external shunt 1pF capacitor. 5, 10 VCC Supply Voltage (2.7V to 5.5V). Bypass VCC to GND at each pin with a 47pF capacitor as close to each pin as possible. 6 RXEN Logic-Level Enable for Receiver Circuitry. A logic high turns on the receiver. When TXEN and RXEN are both at a logic high, the part is placed in standby mode, with a supply current of 160µA (typical). If TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with a supply current of 0.1µA (typical). 7 LO 50Ω Local-Oscillator (LO) Input Port. AC couple to this pin. 8 LO 50Ω Inverting Local-Oscillator Input Port. For single-ended operation connect LO directly to GND. If a differential LO signal is available, AC couple the inverted LO signal to this pin. 9 TXEN 11 GC 13 PADROUT 15, 17 GND 16 PADRIN 19 TXMXOUT Ground. Connect to PC board ground plane with minimal inductance. Logic-Level Enable for Transmitter Circuitry. A logic high turns on the transmitter. When TXEN and RXEN are both at a logic high, the part is placed in standby mode, with 160µA (typical) supply current. If TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with 0.1µA (typical) supply current. Gain-Control Input for Power-Amplifier Driver. By applying an analog control voltage between 0V and 2.15V, the gain of the PA driver can be adjusted over a 35dB range. Connect to V CC for maximum gain. Power-Amplifier Driver Output. AC couple to this pin. Use external shunt inductor to V CC to match this pin to 50Ω. This also provides DC bias. See the Typical Operating Characteristics for a plot of PADROUT Impedance vs. Frequency. Power-Amplifier Driver Input Ground. Connect to PC board ground plane with minimal inductance. RF Input to Variable-Gain Power-Amplifier Driver. AC couple to this pin. Internally matched to 50Ω. This input typically provides a 2:1 VSWR at 1.9GHz. See the Typical Operating Characteristics for a plot of PADRIN Impedance vs. Frequency. RF Output of Transmit Mixer (Upconverter). AC couple to this pin. Use an external shunt inductor to VCC as part of a matching network to 50Ω. This also provides DC bias. See the Typical Operating Characteristics for a plot of TXMXOUT Impedance vs. Frequency. IF Output of Receive Mixer (Downconverter). AC couple to this pin. This output is an open collector and should be pulled up to VCC with an inductor. This inductor can be part of the matching network to the desired IF impedance. Alternatively, a resistor can be placed in parallel to this inductor to set a terminating impedance. See the Typical Operating Circuit for more information. 21 IFOUT 22 IFIN IF Input of Transmit Mixer (Upconverter). AC couple to this pin. IFIN presents a high input impedance and typically requires a matching network. See the Typical Operating Characteristics for a plot of IFIN Impedance vs. Frequency. 24 RXMXIN RF Input to Receive Mixer (Downconverter). AC couple to this pin. This input typically requires a matching network for connecting to an external filter. See the Typical Operating Characteristics for a plot of RXMXIN Impedance vs. Frequency. 25 GND Receive Mixer Input Ground. Connect to PC board ground plane with minimal inductance. 26 GND LNA Output Ground. Connect to PC board ground plane with minimal inductance. 27 LNAOUT LNA Output. AC couple to this pin. This output typically provides a VSWR of better than 2:1 at frequencies from 1.7GHz to 3GHz with no external matching components. At other frequencies, a matching network may be required to match this pin to an external filter. Consult the Typical Operating Characteristics for a plot of LNA Output Impedance vs. Frequency. _______________________________________________________________________________________ www.BDTIC.com/maxim Low-Cost RF Up/Downconverter with LNA and PA Driver 1 220pF 2 LNA INPUT GND GND LNAIN LNAOUT 28 220pF 27 LNA OUTPUT 1pF 3 4 GND GND GND GND VCC RXMXIN 26 25 VCC 5 MAX2410 47pF GND 220pF 7 LO INPUT IFIN LO 24 3.9nH 220pF 82nH 1000pF 23 22 TX MIXER IFINPUT VCC 8 1000pF LO 68nH ROPT VCC 10 IFOUT VCC 47pF GND VCC GND 1000pF GND 21 1000pF 68nH 20 50Ω RX MIXER IFOUTPUT VCC 18 1000pF 17 18nH PA DRIVER OUTPUT RX MIXER RFINPUT 5.6nH 220pF 13 12 14 PADROUT TXMXOUT GND PADRIN GND GND TXEN RXEN 9 6 _______________Detailed Description The MAX2410 consists of five major components: a transmit mixer, a variable-gain power-amplifier (PA) driver, a low-noise amplifier (LNA), a receive mixer, and power-management section. The following sections describe each block in the MAX2410 Functional Diagram. 19 16 15 3.9nH 220pF 220pF TX MIXER RFOUTPUT PA DRIVER INPUT GC 11 Low-Noise Amplifier (LNA) The LNA is a wideband, single-ended cascode amplifier that can be used over a wide range of frequencies (refer to the LNA Gain vs. Frequency graph in the Typical Operating Characteristics). Its port impedances are optimized for operation around 1.9GHz, requiring only a 1pF shunt capacitor at the LNA input for a VSWR of better than 2:1 and a noise figure of 2.4dB. As with every LNA, the input match can be traded off for better noise figure. _______________________________________________________________________________________ www.BDTIC.com/maxim 9 MAX2410 Typical Operating Circuit MAX2410 Low-Cost RF Up/Downconverter with LNA and PA Driver PA Driver The PA driver typically has 15dB of gain, which is adjustable over a 35dB range via the GC pin. At full gain, the PA driver has a noise figure of 3.5dB at 1.9GHz. For input and output matching information, refer to the Typical Operating Characteristics for plots of PA Driver Input and Output Impedance vs. Frequency. Receive Mixer The receive mixer is a wideband, double-balanced design with excellent noise figure and linearity. The inputs to the mixer are the RF signal at the RXMXIN pin and the LO inputs at LO and LO. The downconverted output signal appears at the IFOUT port. The conversion gain of the receive mixer is typically 8.3dB with a noise figure of 9.8dB. RF Input The RXMXIN input is typically connected to the LNA output through an off-chip filter. This input is externally matched to 50Ω. See the Typical Operating Circuit for an example matching network and the RXMXIN Impedance vs. Frequency graph in the Typical Operating Characteristics. Local-Oscillator Inputs The LO and LO pins are internally terminated with 50Ω on-chip resistors. AC couple the LO signal to these pins. If a single-ended LO source is used, connect LO directly to ground. IF Output Port The MAX2410’s receive mixer output appears at the IFOUT pin, an open-collector output that requires an external pull-up inductor to VCC. This inductor can be part of a matching network to the desired IF impedance. Alternatively, a resistor can be placed in parallel with the pull-up inductor to set a terminating impedance. The MAX2411A, a similar part to the MAX2410, has the same functionality as the MAX2410 but offers a differential, bidirectional (transmit and receive) IF port. This allows sharing of TX and RX IF filters, which for some applications provides a lower cost, smaller solution. RF Output The transmit mixer output appears on the TXMXOUT pin. It is an open-collector output that requires an external pull-up inductor to VCC for DC biasing, which can be part of an impedance-matching network. Consult the Typical Operating Characteristics for a plot of TXMXOUT Impedance vs Frequency. IF Input The IFIN pin is a self-biasing input that must be ACcoupled to the IF source. Refer to the Typical Operating Characteristics for plots of Input and Output Impedance vs. Frequency. Local-Oscillator Inputs The LO and LO pins are terminated with 50Ω on-chip resistors. AC couple the LO signal to these pins. If a single-ended LO source is used, connect LO directly to GND. Advanced System Power Management RXEN and TXEN are the two separate power-control inputs for the receiver and the transmitter. If both inputs are at logic 0, the part enters shutdown mode and the supply current drops below 1µA. When one input is brought to a logic 1, the corresponding function is enabled. If RXEN and TXEN are both set to logic 1, the part enters standby mode as described in the Standby Mode section. Table 1 summarizes these operating modes. Power-down is guaranteed with a control voltage at or below 0.6V. The power-down function is designed to reduce the total power consumption to less than 1µA in less than 2.5µs. Complete power-up will happen in the same amount of time. Table 1. Advanced System PowerManagement Functions RXEN TXEN FUNCTION 0 0 Shutdown 0 1 Transmit 1 0 Receive 1 1 Standby Mode Transmit Mixer The transmit mixer takes an IF signal at the IFIN pin and upconverts it to an RF frequency at the TXMXOUT pin. The conversion gain is typically 10dB and the output 1dB compression point is typically -11.4dBm at 1.9GHz. 10 ______________________________________________________________________________________ www.BDTIC.com/maxim Low-Cost RF Up/Downconverter with LNA and PA Driver Applications Information Extended Frequency Range The MAX2410 has been characterized at 1.9GHz for use in PCS-band applications; however, it operates over a much wider frequency range. The LNA gain and noise figure, as well as mixer conversion gain, are plotted over a wide frequency range in the Typical Operating Characteristics. When operating the device at RF frequencies other than those specified in the AC Electrical Characteristics table, it may be necessary to design or alter the matching networks on the RF ports. If the IF frequency is different than that specified in the AC Electrical Characteristics table, the IFIN and IFOUT matching networks must be altered. The Typical Operating Characteristics provide Port Impedance Data vs. Frequency on all RF and IF pins for use in designing matching networks. The LO port (LO and LO) is internally terminated with 50Ω resistors and provides a VSWR of approximately 1.2:1 to 2GHz and 2:1 up to 3GHz. Layout Issues A properly designed PC board is an essential part of any RF/microwave circuit. Be sure to use controlled impedance lines on all high-frequency inputs and outputs. Use low-inductance connections to ground on all GND pins, and place decoupling capacitors close to all VCC connections. For the power supplies, a star topology works well. In a star topology, each VCC node in the circuit has its own path to the central VCC, and its own decoupling capacitor which provides a low impedance at the RF frequency of interest. The central V CC node has a large decoupling capacitor as well, to provide good isolation between the different sections of the MAX2410. The MAX2410 EV kit layout can be used as a guide to integrating the MAX2410 into your design. _________________________________________Typical Application Block Diagram RF BPF MATCH RX MIXER LNA LNAIN IFOUT ANTENNA RF BPF T/R RXEN TXEN RECEIVE IFOUT MATCH IF BPF POWER MANAGEMENT LO LOCAL OSCILLATOR LO MAX2410 PA DRIVER MATCH RF BPF IFIN PADROUT TX MIXER GC RF BPF CBLOCK TRANSMIT IFIN MATCH IF BPF MATCH ______________________________________________________________________________________ www.BDTIC.com/maxim 11 MAX2410 Standby Mode When the TXEN and RXEN pins are both set to logic 1, all functions are disabled and the supply current drops to 160µA (typical). This mode is called standby, and it corresponds to a standby mode on the compatible IF transceiver chips MAX2510 and MAX2511. ________________________________________________________Package Information QSOP.EPS MAX2410 Low-Cost RF Up/Downconverter with LNA and PA Driver 12 ______________________________________________________________________________________ www.BDTIC.com/maxim