PTFC261402FC Thermally-Enhanced High Power RF LDMOS FET Description
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PTFC261402FC Thermally-Enhanced High Power RF LDMOS FET Description
PTFC261402FC Confidential, Limited Internal Distribution Thermally-Enhanced High Power RF LDMOS FET 140 W, 28 V, 2620 – 2690 MHz Description The PTFC261402FC is a 140-watt LDMOS FET intended for use in multi-standard cellular power amplifier applications in the 2620 to 2690 MHz frequency band. Features include input and output matching, high gain and thermally-enhanced package with earless flange. Manufactured with Infineon's advanced LDMOS process, this device provides excellent thermal performance and superior reliability. PTFC261402FC Package H-37248-4 Features Single-carrier WCDMA Drive-up VDD = 28 V, IDQ = 900 mA, ƒ = 2620 MHz 3GPP WCDMA signal, 7.5 dB PAR, 3.84 MHz BW Efficiency 20 Wide video bandwidth • Typical pulsed CW performance, 2655 MHz, 28 V (combined outputs) - Output power at P1dB = 140 W - Efficiency = 50% - Gain = 16.5 dB • Typical single-carrier WCDMA performance, 2655 MHz, 28 V - Output power = 46 dBm avg - Gain = 17.5 dB - Efficiency = 30.5% • Capable of handling 10:1 VSWR @ 28 V, 140 W (CW) output power • Integrated ESD protection • Low thermal resistance • Pb-free and RoHS compliant 40 Gain 16 20 12 0 PAR @ 0.01% CCDF 8 -20 4 -40 0 c261402fc_gr1 33 Broadband internal matching • 60 38 43 48 Efficiency (%) Peak/Average (dB), Gain (dB) 24 • -60 53 Average Output Power (dBm) RF Characteristics Single-carrier WCDMA Specifications (combined outputs) VDD = 28 V, IDQ = 900 mA, POUT = 28 W avg, ƒ = 2655 MHz, 3GPP signal, channel bandwidth = 3.84 MHz, peak/average = 10 dB @ 0.01% CCDF Characteristic Symbol Min Typ Max Unit Gain Gps 17 18 — dB Drain Efficiency ηD 23.5 25 — % ACPR — –34 –31 dBc Adjacent Channel Power Ratio All published data at TCASE = 25°C unless otherwise indicated ESD: Electrostatic discharge sensitive device—observe handling precautions! Data Sheet – DRAFT ONLY 1 of 10 Rev. 04, 2013-02-04 PTFC261402FC Confidential, Limited Internal Distribution DC Characteristics (each side) Characteristic Conditions Symbol Min Typ Max Unit Drain-Source Breakdown Voltage VGS = 0 V, IDS = 10 mA V(BR)DSS 65 — — V Drain Leakage Current VDS = 28 V, VGS = 0 V IDSS — — 1 µA VDS = 63 V, VGS = 0 V IDSS — — 10 µA RDS(on) — 0.1 — Ω On-State Resistance VGS = 10 V, VDS = 0.1 V Operating Gate Voltage VDS = 28 V, IDQ = 900 mA VGS — 2.5 — V Gate Leakage Current VGS = 10 V, VDS = 0 V IGSS — — 1 µA Maximum Ratings Parameter Symbol Value Unit Drain-Source Voltage VDSS 65 V Gate-Source Voltage VGS –6 to +10 V Junction Temperature TJ 200 °C Storage Temperature Range TSTG –65 to +150 °C Thermal Resistance (TCASE = 70°C, 140 W CW) RθJC 0.30 °C/W Ordering Information Type and Version Order Code Package and Description Shipping PTFC261402FC V1 PTFC261402FCV1XWSA1 Thermally-enhanced earless flange, push-pull Tray PTFC261402FC V1 R250 PTFC261402FCV1R250XTMA1 Thermally-enhanced earless flange, push-pull Tape & Reel, 250 pcs Pinout Diagram Gate Drain G1 D1 G2 D2 Gate Drain H -37248 - 4_pd_ 03- 23-2010 Source (flange) Lead connections for PTFC261402FC Data Sheet – DRAFT ONLY 2 of 10 Rev. 04, 2013-02-04 PTFC261402FC Confidential, Limited Internal Distribution Typical Performance (data taken in a production test fixture) Single-carrier WCDMA Drive-up Single-carrier WCDMA Drive-up VDD = 28 V, IDQ = 900 mA, ƒ = 2655 MHz 3GPP WCDMA signal, 7.5 dB PAR, 3.84 MHz BW VDD = 28 V, IDQ = 900 mA, ƒ = 2690 MHz 3GPP WCDMA signal, 7.5 dB PAR, 3.84 MHz BW 24 40 Gain 16 20 12 0 PAR @ 0.01% CCDF 8 -20 4 -40 c261402fc_g r2 38 43 48 -60 20 16 20 12 0 PAR @ 0.01% CCDF 8 -20 4 -40 0 53 c261402fc_gr3 33 Single-carrier WCDMA 3GPP Drive-up 49 40 18 48 30 -40 20 Efficiency ACP Up ACP Low 10 c261402fc_gr5 43 48 Efficiency 46 16 Gain 15 45 14 44 13 2570 0 53 c261402fc_gr8 2610 2650 2690 43 2730 Frequency (MHz) Average Output Power (dBm) Data Sheet – DRAFT ONLY 47 17 Gain (dB) ACPR (dB) 19 -30 38 -60 53 50 Drain Efficiency(%) 2620 MHz 2655 MHz 2690 MHz 33 48 VDD = 28 V, IDQ = 900 mA, POUT = 50 dBm, 3GPP WCDMA signal, 7.5 dB PAR -10 -60 43 Single-carrier WCDMA Broadband Performance VDD = 28 V, IDQ = 900 mA, 3GPP WCDMA signal, 7.5 dB PAR, 3.84 MHz BW -50 38 Average Output Power (dBm) Average Output Power (dBm) -20 40 Gain DrainEfficiency(%) 0 33 Peak/Average (dB), Gain (dB) 20 60 Efficiency Efficiency (%) 60 Efficiency Efficiency (%) Peak/Average (dB), Gain (dB) 24 3 of 10 Rev. 04, 2013-02-04 PTFC261402FC Confidential, Limited Internal Distribution Typical Performance (cont.) Single-carrier WCDMA Broadband Performance Single-carrier WCDMA Broadband Performance VDD = 28 V, IDQ = 900 mA, POUT = 50 dBm, 3GPP WCDMA signal, 7.5 dB PAR VDD = 28 V, IDQ = 900 mA, POUT = 49 dBm, 3GPP WCDMA signal, 7.5 dB PAR -5 19 -10 -10 18 -15 -15 -20 -20 -5 47 ACP Up -25 -25 46 Gain 17 45 16 44 Efficiency (%) Gain (dB) Return Loss (dB) ACP Up (dBc) Return Loss 43 15 Efficiency -30 2730 14 2570 c 261402f c_gr9 2610 2650 2690 2690 2730 Single-carrier WCDMA Broadband Performance Single-carrier WCDMA Broadband Performance VDD = 28 V, IDQ = 900 mA, POUT = 49 dBm, 3GPP WCDMA signal, 7.5 dB PAR VDD = 28 V, IDQ = 900 mA, POUT = 48 dBm, 3GPP WCDMA signal, 7.5 dB PAR 19 47 -10 18 45 Return Loss -15 -15 -20 -20 -30 2570 Gain Gain (dB) -10 -5 Return Loss (dB) -5 ACP Up (dBc) 2650 Frequency (MHz) Frequency (MHz) -25 -25 ACP Up 2650 2690 43 16 41 14 2570 -30 2730 39 Efficiency c261402f c_gr12 2610 2650 2690 37 2730 Frequency (MHz) Frequency (MHz) Data Sheet – DRAFT ONLY 17 15 c261402f c_gr11 2610 42 c261402f c_gr10 2610 Efficiency (%) -30 2570 4 of 10 Rev. 04, 2013-02-04 PTFC261402FC Confidential, Limited Internal Distribution Typical Performance (cont.) CW Performance Single-carrier WCDMA Broadband Performance VDD = 28 V, IDQ = 900 mA VDD = 28 V, IDQ = 900 mA, POUT = 48 dBm, 3GPP WCDMA signal, 7.5 dB PAR -5 -5 20 -10 -10 19 -15 -15 -20 -20 60 ACP Up -30 2570 2650 2690 18 30 17 -25 16 -30 2730 15 2620 MHz 2655 MHz 2690 MHz c261402f c_gr14 CW Performance at selected VDD, (single side) IDQ = 900 mA, ƒ = 2655 MHz IDQ = 900 mA, ƒ = 2620 MHz 20 45 19 35 Gain 17 25 Efficiency 15 c261402f c_gr15 34 36 38 40 42 44 46 48 50 60 50 40 18 30 17 15 16 5 15 Efficiency 20 10 c261402f c_gr16 34 52 Output Power (dBm) Data Sheet – DRAFT ONLY VDD = 32 V VDD = 28 V VDD = 24 V Gain Gain (dB) Gain (dB) 18 55 Efficiency (%) VDD = 32 V VDD = 28 V VDD = 24 V 16 0 Output Power (dBm) CW Performance at selected VDD, (single side) 19 10 33 35 37 39 41 43 45 47 49 51 53 Frequency (MHz) 20 20 Efficiency Efficiency (%) Gain (dB) 40 c261402fc_gr13 2610 50 Gain Efficiency (%) -25 Return Loss (dB) ACP Up (dBc) Return Loss 36 38 40 42 44 46 48 50 0 52 Output Power (dBm) 5 of 10 Rev. 04, 2013-02-04 PTFC261402FC Confidential, Limited Internal Distribution Typical Performance (cont.) CW Performance at selected VDD, (single side) Small Signal CW Gain & Input Return Loss, single side IDQ = 900 mA, ƒ = 2690 MHz VDD = 28 V, IDQ = 900 mA -5 20 18 40 17 30 Efficiency 16 20 VDD = 32 V VDD = 28 V VDD = 24 V 15 c261402f c_gr17 36 38 40 42 44 46 -10 19 -15 -20 Gain 18 -25 10 14 34 IRL Gain (dB) 50 Efficiency (%) Gain (dB) Gain 19 48 50 -30 17 2540 0 52 Input Return Loss (dB) 60 20 -35 2740 c261402f c_gr19 2580 2620 2660 2700 Frequency (MHz) Output Power (dBm) Load Pull Performance Z Source Z Load D S G G D Single Side Load Pull Performance – Pulsed CW signal: 16 µsec, 10% duty cycle; 28 V, 450 mA P1dB Max Output Power Max PAE Freq [MHz] Zs Ω Zl Ω Gain [dB] POUT [dBm] POUT [W] PAE % Zl Ω Gain [dB] POUT [dBm] POUT [W] PAE % 2620 12.1 – j1.0 2.0 – j8.8 15.8 50.01 100 53.9 3.8 – j7.4 18 48.39 69 60.2 2655 15.7 – j0.2 2.0 – j9.0 15.7 49.98 99 53.2 3.5 – j7.7 17.9 48.50 71 59.5 2690 17.8 – j12.4 2.0 – j9.2 15.7 49.79 95 51.3 3.6 – j7.8 18.1 48.38 69 58.8 Data Sheet – DRAFT ONLY 6 of 10 Rev. 04, 2013-02-04 PTFC261402FC Confidential, Limited Internal Distribution Reference Circuit DUT PTFC261402FC Test Fixture Part No. LTN/PTFC261402FC PCB Rogers 4350, 0.508 mm [.020"] thick, 2 oz. copper, εr = 3.66 Find Gerber files for this test fixture on the Infineon Web site at (http://www.infineon.com/rfpower) C803 C802 R805 R802 C801 R04350, .020 (60) R04350, .020 (60) VDD S5 S3 S4 C204 S2 C102 C101 C104 C209 PTFC261402FC R103 L1 RF_IN VDD R803 R804 R104 C202 C203 L2 R103 S6 C208 C205 C207 RF_OUT C211 R101 VDD C212 C201 C103 S1 C210 C804 C208 PTFC261402_OUT_01 PTFC261402_IN_01 c261402fc_cd_1-30-13 Reference circuit assembly diagram (not to scale) Data Sheet – DRAFT ONLY 7 of 10 Rev. 04, 2013-02-04 PTFC261402FC Confidential, Limited Internal Distribution Reference Circuit (cont.) Components Information Component Description Suggested Supplier P/N C101, C104 Chip capacitor, 10 pF ATC ATC800A100JT C102, C103 Capacitor, 10 µF Digi-Key 490-4393-2-ND C801, C802, C803 Capacitor, 1 nF Digi-Key PCC1772CT-ND L1, L2 Chip inductor, 47 nH Coilcraft 0603HP-47NXJLU R101, R102 Resistor, 10 W Digi-Key P10GCT-ND R103, R104 Resistor, 10 W Digi-Key P10ECT-ND R801, R804 Resistor, 1k W Digi-Key P1.0KECT-ND R802 Resistor, 1.3k W Digi-Key P1.3KGCT-ND R803 Resistor, 1.2k W Digi-Key P1.2KGCT-ND S1, S2 High frequency EMI filter, 1 µF Digi-Key 490-6974-1-ND S3 Potentiometer, 2k W Digi-Key 3224W-202ECT-ND Input S4 Voltage Regulator National Semiconductor LM7805 S5 Transistor Infineon Technologies BCP56 Output C201, C202, C203, C210 Capacitor, 10 µF Digi-Key 587-1818-2-ND C204, C208 Electrolytic capacitor, 220 µF Digi-Key PCE4444TR-ND C205, C206 Chip capacitor, 1 pF ATC ATC800A1R2BT C206, C211 Chip capacitor, 2 pF ATC ATC800A1R6BT C207 Chip capacitor, 8 pF ATC ATC800A8R2CT C209, C212 Chip capacitor, 10 pF ATC ATC800A100JT Data Sheet – DRAFT ONLY 8 of 10 Rev. 04, 2013-02-04 PTFC261402FC Confidential, Limited Internal Distribution Package Outline Specifications Package H-37248-4 >@ >@ ;; >;@ > 5 @ ;5 ; >@ )/$1*( >@ &/ ' ' /,' >@ >@ &/ * * ; >@ ; >@ 63+ >@ >@ >@ >@ $ +BSRBB >@ 6 &/ >@ Diagram Notes—unless otherwise specified: 1. Interpret dimensions and tolerances per ASME Y14.5M-1994. 2. Primary dimensions are mm. Alternate dimensions are inches. 3. All tolerances ± 0.127 [.005] unless specified otherwise. 4. Pins: D1, D2 – drains; G1, G2 – gates; S – source. 5. Lead thickness: 0.10 + 0.076/–0.025 mm [0.004+0.003/–0.001 inch]. 6. Gold plating thickness: 1.14 ± 0.38 micron [45 ± 15 microinch]. Find the latest and most complete information about products and packaging at the Infineon Internet page (http://www.infineon.com/rfpower) Data Sheet – DRAFT ONLY 9 of 10 Rev. 04, 2013-02-04 PTFC261402FC V1 Confidential, Limited Internal Distribution Revision History: Previous Version: Page all 2013-02-04 2012-06-01, Advance Specification Subjects (major changes since last revision) Data sheet now reflects production-released Product. Data Sheet We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: ([email protected]) To request other information, contact us at: +1 877 465 3667 (1-877-GO-LDMOS) USA or +1 408 776 0600 International Edition 2013-02-04 Published by Infineon Technologies AG 85579 Neubiberg, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com/rfpower). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Data Sheet – DRAFT ONLY 10 of 10 Rev. 04, 2013-02-04