Package outline SOT740-2

Package outline
LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm
A
B
D
SOT740-2
ball A1
index area
A
E
A2
A1
detail X
C
e1
e
∅v M C A B
b
1/2 e
y
y1 C
∅w M C
T
R
e
P
N
M
L
K
J
e2
H
G
1/2 e
F
E
D
C
B
A
ball A1
index area
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
X
5
0
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
A2
b
D
E
e
e1
e2
v
w
y
y1
mm
1.55
0.45
0.35
1.1
0.9
0.55
0.45
17.2
16.8
17.2
16.8
1
15
15
0.25
0.1
0.12
0.35
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT740-2
---
MO-192
---
www.nxp.com
© 2008 NXP B.V.
EUROPEAN
PROJECTION
ISSUE DATE
05-06-16
05-08-04
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Printed in the Netherlands