Package outline SOT1155-2

Package outline
TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 x 4.5 x 0.7 mm
B
D
SOT1155-2
A
ball A1
index area
E
A
A2
A1
detail X
e1
C
e
C A B
C
Øv
Øw
1/2 e b
H
y
y1 C
e
G
F
E
e2
D
1/2 e
C
B
A
ball A1
index area
1
2
3
4
5
6
7
solder mask open area
not for solder ball
8
0
5 mm
scale
Dimensions
Unit
A
A1
A2
D
E
e
e1
e2
4.6
4.5
4.4
4.6
4.5
4.4
0.5
3.5
3.5
b
max 1.10 0.30 0.80 0.35
nom 0.95 0.25 0.70 0.30
min 0.85 0.20 0.65 0.25
mm
X
v
w
y
0.15 0.05 0.08
y1
0.1
sot1155-2_po
Outline
version
References
IEC
SOT1155-2
www.nxp.com
JEDEC
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© 2010 NXP B.V.
JEITA
European
projection
Issue date
13-06-17
13-06-19
All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not
form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights.
Printed in the Netherlands