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Package outline SOT500-2

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Package outline SOT500-2
Package outline
PLLMC: plastic leadless module carrier package; 35 mm wide tape
SOT500-2
X
D
A
detail X
0
10
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
max.
D
mm
0.33
35.05
34.95
20 mm
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
Note
1. Total package thickness, exclusive punching burr.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT500-2
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www.nxp.com
© 2008 NXP B.V.
EUROPEAN
PROJECTION
ISSUE DATE
03-09-17
06-05-22
All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not
form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights.
Printed in the Netherlands
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