www.BDTIC.com/XILINX Flip-Chip BGA (FF665) Package 665 BALL - FLIP-CHIP BGA (FF665)

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Flip-Chip BGA (FF665) Package
PK220 (v1.0) March 22, 2007
665 BALL - FLIP-CHIP BGA (FF665)
27 X 27mm BODY (1.00mm PITCH)
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All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
PK220 (v1.0) March 22, 2007
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1
Flip-Chip BGA (FF665) Package
Revision
History
2
The following table shows the revision history for this document.
Date
Version
3/22/07
1.0
Revision
Initial Xilinx release.
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PK220 (v1.0) March 22, 2007