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SOT-23 Plastic-Encapsulate Diodes DAP202
JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-23 Plastic-Encapsulate Diodes SOT-23 DAP202 SWITCHING DIODE FEATURES High Speed High Reliability Suitable for High Packing Density Layout APPLICATIONS BDTIC High Speed Switching MARKING: P MAXIMUM RATINGS ( Ta=25℃ unless otherwise noted ) Symbol Parameter Value Unit VR DC Blocking Voltage 80 V IO Continuous Forward Current 100 mA IFM Peak Forward Current 300 mA ISM Surge Current 4 A PD Power Dissipation 200 mW Thermal Resistance from Junction to Ambient 625 ℃/W Tj Junction Temperature 150 ℃ Tstg Storage Temperature -55~+150 ℃ RθJA ELECTRICAL CHARACTERISTICS(Ta=25℃ unless otherwise specified) Parameter Symbol Test conditions Typ Max V(BR) Reverse current IR VR=70V 0.1 μA Forward voltage VF IF=100mA 1.2 V Total capacitance Ctot VR=6V,f=1MHz 3.5 pF 4 ns trr 80 Unit Reverse voltage Reverse recovery time IR=100μA Min IF= IR=5mA, VR=6V www.BDTIC.com/jcst V Typical Characteristics Forward 100 Characteristics Characteristics 300 (nA) (mA) Ta =2 5℃ 3 REVERSE CURRENT IR 10 Ta =1 00 ℃ IF Reverse 1000 30 FORWARD CURRENT DAP202 1 Ta=100℃ 100 30 10 Ta=25℃ 3 0.3 0.1 0.0 1 0.2 0.4 0.6 FORWARD VOLTAGE 0.8 VF 1.0 1.2 0 20 (V) 40 REVERSE VOLTAGE 60 VR 80 (V) BDTIC Capacitance Characteristics 1.4 Power Derating Curve 300 Ta=25℃ f=1MHz (mW) PD POWER DISSIPATION CAPACITANCE BETWEEN TERMINALS CT (pF) 250 1.3 1.2 1.1 200 150 100 50 1.0 0 0 5 10 REVERSE VOLTAGE 15 VR (V) 20 0 25 50 75 AMBIENT TEMPERATURE www.BDTIC.com/jcst 100 Ta 125 (℃) 150