Opti MOS 3 Power-Transistor IPB200N15N3 G IPD200N15N3 G

IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
OptiMOS™3 Power-Transistor
IPP200N15N3 G
Product Summary
Features
• N-channel, normal level
• Excellent gate charge x R DS(on) product (FOM)
VDS
150
V
RDS(on),max
20
mW
ID
50
A
• Very low on-resistance R DS(on)
• 175 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC1) for target application
BDTIC
• Ideal for high-frequency switching and synchronous rectification
• Halogen-free according to IEC61249-2-21
Type
IPB200N15N3 G
IPD200N15N3 G
IPI200N15N3 G
IPP200N15N3 G
Package
PG-TO263-3
PG-TO252-3
PG-TO262-3
PG-TO220-3
Marking
200N15N
200N15N
200N15N
200N15N
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
Value
T C=25 °C
50
T C=100 °C
40
Pulsed drain current2)
I D,pulse
T C=25 °C
200
Avalanche energy, single pulse
E AS
I D=50 A, R GS=25 W
170
Reverse diode dv /dt
dv /dt
I D=50 A, V DS=120 V,
di /dt =100 A/µs,
T j,max=175 °C
Gate source voltage
V GS
Power dissipation
P tot
Operating and storage temperature
T j, T stg
T C=25 °C
IEC climatic category; DIN IEC 68-1
1)
2)
6
Unit
A
mJ
kV/µs
±20
V
150
W
-55 ... 175
°C
55/175/56
J-STD20 and JESD22
See figure 3
Rev. 2.07
www.BDTIC.com/infineon
page 1
2014-01-09
IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
Parameter
IPP200N15N3 G
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
1
minimal footprint
-
-
75
6 cm2 cooling area3)
-
-
50
Thermal characteristics
Thermal resistance, junction - case
R thJC
Thermal resistance, junction ambient
R thJA
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
BDTIC
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=1 mA
Gate threshold voltage
V GS(th)
Zero gate voltage drain current
I DSS
150
-
-
V DS=V GS, I D=90 µA
2
3
4
V DS=120 V, V GS=0 V,
T j=25 °C
-
0.1
1
V DS=120 V, V GS=0 V,
T j=125 °C
-
10
100
V
µA
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
1
100
nA
Drain-source on-state resistance
R DS(on)
V GS=10 V, I D=50 A
-
16
20
mW
V GS=8 V, I D=25 A
-
16
20
-
2.4
-
W
29
57
-
S
Gate resistance
RG
Transconductance
g fs
|V DS|>2|I D|R DS(on)max,
I D=50 A
3)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 2.07
www.BDTIC.com/infineon
page 2
2014-01-09
IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
Parameter
IPP200N15N3 G
Values
Symbol Conditions
Unit
min.
typ.
max.
-
1820
-
-
214
-
Dynamic characteristics
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
C rss
-
5
-
Turn-on delay time
t d(on)
-
14
21
Rise time
tr
-
11
17
Turn-off delay time
t d(off)
-
23
35
Fall time
tf
-
6
9
Gate to source charge
Q gs
-
10
14
Gate to drain charge
Q gd
-
4
6
Switching charge
Q sw
-
9
13
Gate charge total
Qg
-
23
31
Gate plateau voltage
V plateau
-
5.7
-
Output charge
Q oss
-
60
79
nC
-
-
50
A
-
-
220
-
1
1.2
V
-
106
-
ns
-
332
-
nC
V GS=0 V, V DS=75 V,
f =1 MHz
V DD=75 V, V GS=10 V,
I D=50 A, R G,ext=1.6 W
pF
ns
BDTIC
Gate Charge Characteristics4)
V DD=75 V, I D=50 A,
V GS=0 to 10 V
V DD=75 V, V GS=0 V
nC
V
Reverse Diode
Diode continous forward current
IS
Diode pulse current
I S,pulse
Diode forward voltage
V SD
Reverse recovery time
t rr
Reverse recovery charge
Q rr
4)
T C=25 °C
V GS=0 V, I F=50 A,
T j=25 °C
V R=75 V, I F=I S,
di F/dt =100 A/µs
See figure 16 for gate charge parameter definition
Rev. 2.07
www.BDTIC.com/infineon
page 3
2014-01-09
IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
1 Power dissipation
2 Drain current
P tot=f(T C)
I D=f(T C); V GS≥10 V
160
IPP200N15N3 G
60
120
Ptot [W]
40
ID [A]
BDTIC
80
20
40
0
0
0
50
100
150
200
0
50
TC [°C]
100
150
200
TC [°C]
3 Safe operating area
4 Max. transient thermal impedance
I D=f(V DS); T C=25 °C; D =0
Z thJC=f(t p)
parameter: t p
parameter: D =t p/T
103
101
1 µs
10 µs
102
100 µs
100
0.5
ZthJC [K/W]
ID [A]
1 ms
101
10 ms
0.2
0.1
10-1
DC
0.05
100
0.02
0.01
single pulse
10-1
10-2
10-1
100
101
102
103
VDS [V]
Rev. 2.07
10-5
10-4
10-3
10-2
10-1
100
tp [s]
www.BDTIC.com/infineon
page 4
2014-01-09
IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
IPP200N15N3 G
5 Typ. output characteristics
6 Typ. drain-source on resistance
I D=f(V DS); T j=25 °C
R DS(on)=f(I D); T j=25 °C
parameter: V GS
parameter: V GS
100
40
7V
10 V
6.5 V
5V
35
5.5 V
6V
8V
80
30
RDS(on) [mW]
6V
60
25
ID [A]
BDTIC
40
5.5 V
20
8V
15
10 V
10
20
5V
5
4.5 V
0
0
0
1
2
3
4
5
0
20
VDS [V]
40
60
80
120
160
ID [A]
7 Typ. transfer characteristics
8 Typ. forward transconductance
I D=f(V GS); |V DS|>2|I D|R DS(on)max
g fs=f(I D); T j=25 °C
parameter: T j
100
80
80
60
60
ID [A]
gfs [S]
100
40
40
20
20
175 °C
25 °C
0
0
0
2
4
6
8
VGS [V]
Rev. 2.07
0
40
80
ID [A]
www.BDTIC.com/infineon
page 5
2014-01-09
IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
IPP200N15N3 G
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
R DS(on)=f(T j); I D=50 A; V GS=10 V
V GS(th)=f(T j); V GS=V DS
parameter: I D
50
4
45
3.5
40
900 µA
3
35
VGS(th) [V]
RDS(on) [mW]
90 µA
2.5
30
BDTIC
25
98%
20
typ
2
1.5
15
1
10
0.5
5
0
0
-60
-20
20
60
100
140
180
-60
-20
20
Tj [°C]
60
100
140
180
Tj [°C]
11 Typ. capacitances
12 Forward characteristics of reverse diode
C =f(V DS); V GS=0 V; f =1 MHz
I F=f(V SD)
parameter: T j
104
103
Ciss
103
102
IF [A]
C [pF]
25 °C
Coss
102
175 °C
25°C, 98%
101
101
Crss
175°C, 98%
100
0
20
40
60
80
100
0.5
1
1.5
2
VSD [V]
VDS [V]
Rev. 2.07
0
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page 6
2014-01-09
IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
13 Avalanche characteristics
14 Typ. gate charge
I AS=f(t AV); R GS=25 W
V GS=f(Q gate); I D=50A pulsed
parameter: T j(start)
parameter: V DD
100
IPP200N15N3 G
10
120 V
8
75 V
25 °C
30 V
100 °C
VGS [V]
IAS [A]
6
BDTIC
125 °C
10
4
2
1
0
1
10
100
1000
0
10
tAV [µs]
20
30
Qgate [nC]
15 Drain-source breakdown voltage
16 Gate charge waveforms
V BR(DSS)=f(T j); I D=1 mA
170
V GS
Qg
165
VBR(DSS) [V]
160
155
150
V gs(th)
145
Q g(th)
140
Q sw
Q gs
135
-60
-20
20
60
100
140
Q gate
Q gd
180
Tj [°C]
Rev. 2.07
www.BDTIC.com/infineon
page 7
2014-01-09
IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
IPP200N15N3 G
PG-TO263-3 Outline
BDTIC
Rev. 2.07
www.BDTIC.com/infineon
page 8
2014-01-09
IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
IPP200N15N3 G
PG-TO252-3 Outline
BDTIC
Rev. 2.07
www.BDTIC.com/infineon
page 9
2014-01-09
IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
IPP200N15N3 G
PG-TO262-3 Outline
BDTIC
Rev. 2.07
www.BDTIC.com/infineon
page 10
2014-01-09
IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
IPP200N15N3 G
PG-TO220-3 Outline
BDTIC
Rev. 2.07
www.BDTIC.com/infineon
page 11
2014-01-09
IPB200N15N3 G IPD200N15N3 G
IPI200N15N3 G
IPP200N15N3 G
BDTIC
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2008 Infineon Technologies AG
All Rights Reserved.
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conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please
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Warnings
Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
Rev. 2.07
www.BDTIC.com/infineon
page 12
2014-01-09